Thermal Infrared Inspections

 Infrared imaging provides important information relating to otherwise inaccessible areas of a residential building. Infrared detects extremely small but crucial differences in temperature from one area of a house to another. These temperature variations show up on the camera view screen as cold or hot spots, which reveal hidden problems that often cannot be detected in the course of a traditional visual inspection.

These problems may include:

·         Faulty wiring, breakers and fuses

·         Hidden moisture intrusion

·         The moisture sources of mold

·         Pipe and duct work leaks

·         Roof and ceiling leaks

·         Foundation cracks

·         Heat/energy loss

·         Structural concerns

·         Missing insulation

·         Ventilation problems                                                                                                                                                                                                                         Combined with traditional home inspection techniques, the infrared inspection method reveals substantially more of the house than can be perceived by the naked eye and conventional inspection tools. Many things can't be be seen with only a flashlight.    

Scanning interior surfaces of a building with an infrared camera can reveal excess moisture due to plumbing leaks, roof leaks, leaks around windows, etc.  Wet areas of building materials cool when energy is transferred during the water evaporation process; therefore, a wet cooler area will stand out from the surrounding dry warmer surface.  

Appreciable temperature differences,due to variations in thermal energy (heat) transfer, allow for detection of deficient or missing insulation when scanning ceiling and wall surfaces   

 Deficiencies within the electrical system can be made visually apparent by use of an infrared camera.  For example, a deficient connection between electrical components can result in resistance which will manifest in an apparent temperature elevation when compared with similar types of connections under similar load conditions.